CVEs-PoC/2018/CVE-2018-11267.md

### [CVE-2018-11267](https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2018-11267)
![](https://img.shields.io/static/v1?label=Product&message=Snapdragon%20Automobile%2C%20Snapdragon%20Mobile%2C%20Snapdragon%20Wear&color=blue)
![](https://img.shields.io/static/v1?label=Version&message=n%2Fa&color=blue)
![](https://img.shields.io/static/v1?label=Vulnerability&message=Improper%20Validation%20of%20Array%20Index%20in%20Core&color=brighgreen)

### Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.

### POC

#### Reference
- https://www.qualcomm.com/company/product-security/bulletins

#### Github
No PoCs found on GitHub currently.