CVEs-PoC/2021/CVE-2021-30324.md

### [CVE-2021-30324](https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2021-30324)
![](https://img.shields.io/static/v1?label=Product&message=Snapdragon%20Auto%2C%20Snapdragon%20Compute%2C%20Snapdragon%20Consumer%20IOT%2C%20Snapdragon%20Industrial%20IOT%2C%20Snapdragon%20Mobile%2C%20Snapdragon%20Voice%20%26%20Music%2C%20Snapdragon%20Wearables%2C%20Snapdragon%20Wired%20Infrastructure%20and%20Networking&color=blue)
![](https://img.shields.io/static/v1?label=Version&message=n%2Fa&color=blue)
![](https://img.shields.io/static/v1?label=Vulnerability&message=Buffer%20Copy%20Without%20Checking%20Size%20of%20Input%20in%20Core%20Services&color=brighgreen)

### Description

Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

### POC

#### Reference
- https://www.qualcomm.com/company/product-security/bulletins/february-2022-bulletin

#### Github
- https://github.com/xmpf/qualcomm-bulletins