mirror of
https://github.com/0xMarcio/cve.git
synced 2026-06-05 06:38:06 +02:00
33 lines
2.2 KiB
Markdown
33 lines
2.2 KiB
Markdown
### [CVE-2017-18157](https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2017-18157)
|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|

|
|
|
|
### Description
|
|
|
|
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
|
|
|
|
### POC
|
|
|
|
#### Reference
|
|
- https://www.qualcomm.com/company/product-security/bulletins
|
|
|
|
#### Github
|
|
- https://github.com/ARPSyndicate/cvemon
|
|
|